
- MATERIAL
- 6063 aluminium
- MOUNT
- Sprung screw, per chip
- INTERFACE
- Phase change TIM
- EFFECT
- x0.97 power draw
- STACKABLE
- 3 sets
- TARGET JUNCTION
- Under 85 C
Heatsink set
The chip does not care how hot the room is. It cares how fast heat leaves its own surface.
What it does
Every hash is paid for in energy and essentially all of that energy becomes heat within microns of where it was spent. A 5 nm die dissipating five watts across a few square millimetres has a heat flux comparable to a stovetop element. The heatsink's job is to move that energy into the air fast enough that the junction temperature stays under control.
This matters commercially, not just mechanically. ASICs throttle when they get hot: the firmware steps the clock down to keep the die inside its limit. A throttled board still draws close to full power while producing less hashrate, so thermal performance shows up directly in your joules per terahash. Better cooling is not comfort, it is efficiency.
Upgraded fin stacks with higher surface area and better thermal interface material buy you a few percent of draw at the same hashrate. Stacked across three boards it compounds.
Thermal paste pumps out over thermal cycles. Contact degrades, the die runs hotter at the same load, and the firmware quietly clocks down.







